Forty high school seniors from across the country were named finalists in the Intel Science Talent Search 2010, a program of Society for Science & the Public..
Finalists will gather in Washington, D.C. in March to compete for $630,000 in awards with the top winner receiving $100,000 from the Intel Foundation.
Intel Science Competition Winners Invited to State of the Union Address
News Highlights
At tonight’s State of the Union address, President and Mrs. Obama will host two of the nation's brightest young scientific minds – one a winner of the Intel International Science and Engineering Fair 2009 and the other a top finalist in the Intel Science Talent Search 2009; both competitions are programs of Society for Science & the Public.
These young scientists are being singled out for their early achievements and their place among the nation's next generation of leaders who will solve the problems of tomorrow.
SANTA CLARA, Calif., Jan. 27, 2010 – Two young scientists – one a winner of the Intel International Science and Engineering Fair 2009 and the other a top finalist in the Intel Science Talent Search 2009, both programs of Society for Science & the Public – are being recognized by the White House for their scientific achievements and will sit with Michelle Obama at tonight's State of the Union address. Li Boynton, a high school senior from Houston, was one of the top three winners in the Intel International Science and Engineering Fair 2009 and is a semifinalist in the Intel Science Talent Search 2010. Gabriela Farfan of Madison, Wis., currently a freshman at Stanford University, earned 10th place at the Intel Science Talent Search 2009.
Prior to attending the State of the Union address, Li and Gabriela will meet with Arne Duncan, U.S. Secretary of Education, and John Holdren, Science and Technology advisor to the president. Intel Corporation shares President Obama's belief that scientists should be regarded as role models, just as athletes and entertainers are, and that innovation and education are key to a successful future. At 4 p.m. EST today, Intel – a partner in President Obama's "Educate to Innovate" campaign – and Society for Science & the Public will name 40 high school seniors as finalists in the Intel Science Talent Search 2010, America's oldest and most prestigious pre-college science competition.
The finalists will gather in Washington, D.C. from March 11-16 to compete for $630,000 in awards. The top winner will receive $100,000 from the Intel Foundation. Visit www.intel.com/pressroom/kits/events/sts2010 after 4 p.m. EST for more information. To learn more about Society for Science & the Public, visit www.societyforscience.org.
PURE Hybrid CrossFire 780G Innovation MBThere are few true revolutions in the PC industry. At the heart of the Sapphire PURE Hybrid CrossFire 780G (PI-AM2RS780G) lies AMD’s revolutionary 780G+SB700 chipset. With the AMD 780G IGP chipset, all the barriers have been broken. This is the first AMD chipset to integrate a powerful DirectX®10 graphics core powered by ATI Radeon™ HD3200 graphics. It’s the first AMD chipset that enables everyday computer users to play the latest games with no additional discrete graphics card, the first mainstream motherboard that delivers a total high definition cinematic experience…… and it does all of this consuming a lot less power then you’d think.
Chipset: AMD® 780G + SB700
Processor: Support AMD® AM2/AM2+ CPU
DirectX ® 10 Gaming
ATI Hybrid CrossFire HD3200 Graphics
Full HD Experience
Ultimate Green PC
HT3.0 support
DDRII DIMM up to 16GB 1066MHz Dual Channel
Internal Video output: DVI-D(HDMI) + VGA
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Socket AM2 64-bit AMD Athlon 64 Processor with HyperTransport Technology AMD64, a revolutionary technology allowing the processor to run 32-bit applications at full speed while enabling a new generation of powerful 64-bit software applications. HyperTransport technology can increase overall system performance by removing I/O bottlenecks, increasing system bandwidth, and reducing system latency. AMD 780G Chipset: Backbone of Hybrid CrossFire Technology Performance Platform AMD 780G chipset based PCs feature the latest PCI-Express 2.0 bus technology and deliver high performance support for AMD’s new Hybrid CrossFireX, allowing the combination of features or raw horse power from both the on board graphics and compatible add in PCI-E graphics boards, for the ultimate High-Def entertainment experience. Low latency architecture coupled with one of the industry’s most advanced core-logic solutions deliver qualified performance and the latest technologies — PCI-Express 2.0, secure high-speed networking, high-performance storage — and ensures that your PC stays ready for the latest games, future applications and next-generation PC specifications AMD SB700 Southbridge Chipset AMD SB700 Southbridge offers the most advanced technologies and superior performance compared to any other chipset platform solution for AMD desktop applications. With superior performance and broad-based connectivity, SB700 is rich in all the latest advanced features such as support for 10 x USB 2.0 ports and 8-Channel audio. Designed for the fastest Windows Vista experience, it features new disk controller technologies that ensure fast file access while providing encryption for data security. AMD SB700 is designed with advanced power management allowing for low power consumption and energy efficient platforms. Pro Magic Plus System Recovery Software Embedded Restore important data immediately, allowing your system to be operated in a safer environment. This amazing software allows you to restore the data to the same state as any specific time point you wish. Moreover, it combines several other functions such as anti-virus, backup software, uninstall software, multi-boot manager etc. to completely satisfy your system protection needs. Worry no more about new virus’s or system failure! Debug Port: The Professional Hardware Diagnosis System The embedded Hardware Debug Port offers you a real-time visual health check for your system. No more being driven crazy by unknown system failures and no more time wasted in the diagnosis of failure. The embedded Debug Port will help you to focus your attention exactly were it is needed, therefore minimizing down time for your system. CPU Vcore 7-Shift The CPU core voltage is adjustable in 13 steps for precise control of hardware over-clocking, maximizing computer performance.
CPU
Socket AM2+ HTT 2600 MHz AMDR Athlon 64 With HyperTransport TechnologyCompatible with 64-bit Dual Core AMDR Athlon 64 X2 Processor and AMD Phenom
Advanced 4+1 Power Design that supports the latest K8/K10 CPU and HT3.0BIOS Debug LED DisplayHybrid CrossFire. Ability to combine the features or raw horsepower of both your on board graphics and those of any Hybrid CrossFireX compatible PCI-e add in board.ATI Radeon HD 3200 Internal Graphic core fully supports DX10HDMI (Audio and Video) function supported by adaptor connect to DVI portSupport for ACPI S3 (Standby) function“IMAGE IT!” System Backup Software and “ProMagicPLUS!” System Recovery System
Rear Panel I / O
4 x High Speed USB Connectors @ 480 Mbit / s1 x PS / 2 Mouse & 1 x PS/2 Keyboard Connector1 x VGA D-Sub 15-pin Connector & 1 x DVI-D Connector1 X RJ45 LAN Connector 1 x 8-Channel Audio I / O
Internal I / O
3 x High Speed USB Connectors @ 480 Mbit / s for 6 USB 2.0 PortsCPU / Chassis Fan Connectors1 x 12V 8-pin ATX Power Connector and 1 x 24-pin ATX Power Connector1 x Serial Port 9-pin Header BlockCD / AUX Audio in ConnectorsFront Audio connectorIR connector1 x Floppy Connector
BIOS
Award 8 MB SPI Flash ROM
Form Factor
mATX Form Factor 245X220mm
Disclaimer: Product specifications subject to change without notice. Product bundle varies by countries, check local dealers for details.
Season's Greetings to all our fellow TeamSpeak communities! The wait is finally over as we are pleased to announce that TeamSpeak 3 open beta has begun. All platform releases (Windows/Mac/Linux) for the TeamSpeak 3 Client and Server can now be found on our updated Downloads page.
A free evaluation of the TeamSpeak 3 SDK is also now available for download. This means you no longer have to apply to request an eval. The TeamSpeak 3 SDK server eval is limited to 1 virtual server and 32 slots and requires Internet access. If your integration project contains special needs (eg - private military or private LAN enviornment) please contact sales@tritoncia.com for assistance.
Please also keep in mind that the TeamSpeak 3 SDK is designed for integrating TeamSpeak voice comms technology into an existing product or service. Developers who are interested in scripting, automation, writing plugins which pertain to the TeamSpeak 3 Client and Server, etc. should NOT need to download the TeamSpeak 3 SDK. Instead, these developers should focus their attention toward TeamSpeak 3 Server query documentation as well as our new TeamSpeak 3 Plugin SDK which is also located on our Downloads page.
Last but certainly not least, a special thank you goes out to everyone involved in the closed alpha and beta testing phases, as well as all pre-release ATHPs and hosters, and anyone else that has assisted us in making TeamSpeak 3 a reality. A sincere and humble THANK YOU to all of you.
We look forward to your feedback and we wish you the best for the 2010 New Year.
Battleswarm™: Field of Honor™ is a revolutionary new game which pits First-Person Shooters against Real-Time Strategists in epic online battles waged between elite Human Soldiers and massive swarms of Bugs. Open to ALL FilePlanet users!!
• Switch between Humans and Bugs - Tactical FPS vs. Strategic RTS • Upgrade your Human commando with powerful weapons like the flamethrower and the Universal Rifle • Enhance your Bug horde with new alien breeds such as Berserkers and the Assassins Battleswarm™:
Now in closed beta! Be a ruler in the magical world of Gaia, command your special heroes to slay beasts and fight other forces of evil. High quality graphics game where you can forge alliances to unite the world under your banner! Alganon
Battlefield Bad Company™ 2 brings the spectacular Battlefield gameplay to the forefront of next-gen consoles. Be one of the first to check out this HOT PlayStation 3 beta!
IGN has secured a limited number keys for its members residing in NORTH AMERICA.
Intel and Numonyx Achieve Research Milestone with Stacked, Cross Point Phase Change Memory Technology
SANTA CLARA, Calif., and GENEVA – Oct. 28, 2009 – Intel Corporation and Numonyx B.V. today announced a key breakthrough in the research of phase change memory (PCM), a new non-volatile memory technology that combines many of the benefits of today's various memory types. For the first time, researchers have demonstrated a 64Mb test chip that enables the ability to stack, or place, multiple layers of PCM arrays within a single die. These findings pave the way for building memory devices with greater capacity, lower power consumption and optimal space savings for random access non-volatile memory and storage applications
Technology uses the brand Vapor-X on all its high performance products based on Vapor Chamber Technology. It has just been revealed that the Vapor chamber technology used in SAPPHIRE Vapor-X coolers comes from Microloops. Vapor-X has very efficient heat dissipation, which helps to remove heat quickly from the hottest component on a graphics card – the GPU. Because this heat transfer is so efficient, the device can be cooled with heatsink fans operating with lower speeds, and therefore lower noise.
It also allows the GPU to be run at higher speeds – known as overclocking – to deliver increased performance. “Sapphire Technology was the first graphics card manufacturer to use Microloop’s Vapor Chamber as the cooling device,” confirms Sapphire CEO Mr. KD Au. “We aspire to give our customers a unique product and create a perfect product integrated energy-saving and low noise design. The Sapphire HD3870 launched in 2007 was the world’s first graphics product using Vapor Chamber cooling. It used an ultra-slim 3mm vapor chamber in a single slot graphics card design, which could dissipate 150W heat. Under test in 3D mode, the Sapphire HD3870 single slot cooler with Vapor Chamber achieved lower operating temperatures than the ATI BBA board dual slot cooling design.” “Following this successful experience, Sapphire created a new range of HD 4000 series cards named the ”Vapor-X Series”, all of which use Vapor Chamber cooling,” added KD. “ The Vapor-X product line is popular in the channel as well as with users and has won over 80 editor awards in the global media.
The Sapphire HD 5000 Vapor-X series will be released in the near future, and I believe that the outstanding performance of the Sapphire HD 5000 with Vapor-X cooling system will be another award winning combination.” 100% of Sapphire’s Vapor Chamber technology comes from Microloops. Microloops and Sapphire Technology started to co-operate in 2007. Microloops Vapor Chamber technology was originally used in high level servers from companies like HP and IBM to avoid high operating temperatures. For both Sapphire and Microloops, the HD3870 was the first graphic card to use Vapor Chamber technology. “We have been working with Sapphire technology for 2 years now, so Vapor Chamber technology is a mature technology for graphics cards,” commented Microloop GM Mr. TS. “ We all know Sapphire’s product design is superior and now combined with Vapor Chamber thermal device, the Vapor-X Series has sold over half million pieces and won over 80 media awards globally. It is a milestone for Microloops, we will keep researching and developing better performance thermal devices and deliver the products on-time.
We look forward to creating a ‘dream’ graphics card combining all the target features -” high performance, low temperature, low noise and low power.” A short description of Vapor-X technology. Vapor Chamber Technology is based on the same principles as heatpipe technology. A liquid coolant is vaporised at a hot surface, the resulting vapor is condensed at a cold surface then the liquid is returned to the hot surface. The recirculation process is controlled by a wick system. SAPPHIRE Vapor-X flattens the whole system into a slim chamber - which in the graphics application is mounted in contact with the surface of the graphics chip. Actually, the coolant is water – but because the chamber is evacuated to a very low pressure, the vaporisation process occurs at a much lower temperature than normal boiling point. The complex wick arrangement inside the module controls the flow of water and water vapor so that the system can be used in any orientation.
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The recirculation process is controlled by a wick system. SAPPHIRE Vapor-X flattens the whole system into a slim chamber - which in the graphics application is mounted in contact with the surface of the graphics chip. Actually, the coolant is water – but because the chamber is evacuated to a very low pressure, the vaporisation process occurs at a much lower temperature than normal boiling point. The complex wick arrangement inside the module controls the flow of water and water vapor so that the system can be used in any orientation.